Light emitting component

ABSTRACT

A light emitting component includes a light emitting unit, a molding compound and a wavelength converting layer. The light emitting unit has a forward light emitting surface. The molding compound covers the light emitting unit. The wavelength converting layer is disposed above the molding compound. The wavelength converting layer has a first surface and a second surface opposite to the first surface, wherein the first surface is located between the forward light emitting surface and the second surface, and at least one of the first and second surfaces is non-planar.

CROSS-REFERENCE TO RELATED APPLICATION

This is a continuation application of and claims the priority benefit ofU.S. application Ser. No. 14/462,581, filed on Aug. 19, 2014, nowallowed, which claims the priority benefit of Taiwan application serialno. 103120334, filed on Jun. 12, 2014. The entirety of each of theabove-mentioned patent applications is hereby incorporated by referenceherein and made a part of this specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a light emitting component and, moreparticularly, to a light emitting component having a wavelengthconverting layer with at least one non-planar surface.

2. Description of the Prior Art

Referring to FIG. 1, FIG. 1 is a schematic view illustrating a lightemitting component 1 of the prior art. As shown in FIG. 1, the lightemitting component 1 comprises a light emitting diode 10 and a phosphormember 12. The phosphor member 12 is formed on the light emitting diode10 by a dispensing process or a spraying process, so as to package thelight emitting diode 10. In general, the phosphor member 12 containsphosphor powders for converting light emitted by the light emittingdiode 10 into a desired light color. As shown in FIG. 1, since thephosphor member 12 covers the light emitting diode 10 directly, adecrease in light intensity may occur in the phosphor powders of thephosphor member 12 due to heat generated by the light emitting diode 10.Furthermore, since a surface 120 of the phosphor member 12 is planar,total reflection may occur easily while the light emitted by the lightemitting diode 10 passes through the surface 120. Moreover, the phosphorpowders excited by the light of the light emitting diode 10 at thesurface 120 are limited, such that the quantity of light output islimited accordingly.

SUMMARY OF THE INVENTION

The invention provides a light emitting component having a wavelengthconverting layer with at least one non-planar surface, so as to solvethe aforesaid problems.

According to an embodiment of the invention, a light emitting componentcomprises a light emitting unit, a molding compound and a wavelengthconverting layer. The light emitting unit has a forward light emittingsurface. The molding compound covers the light emitting unit. Thewavelength converting layer is disposed above the molding compound. Thewavelength converting layer has a first surface and a second surfaceopposite to the first surface, wherein the first surface is locatedbetween the forward light emitting surface and the second surface, andat least one of the first and second surfaces is non-planar.

Preferably, the first surface contacts the molding compound and isnon-planar.

Preferably, the second surface is non-planar.

Preferably, the light emitting component further comprises a lighttransmissible member disposed on the wavelength converting layer,wherein the second surface contacts the light transmissible member andis planar.

Preferably, the light emitting component further comprises a lighttransmissible member disposed between the molding compound and thewavelength converting layer, wherein the first surface contacts thelight transmissible member and is planar, and the second surface isnon-planar.

Preferably, the wavelength converting layer is capable of deforming whena mechanical force is exerted on the wavelength converting layer.

Preferably, the light emitting component further comprises a reflectivelayer disposed on a side light emitting surface of the light emittingunit around the forward light emitting surface.

As mentioned in the above, the invention disposed the wavelengthconverting layer above the molding compound, such that the wavelengthconverting layer does not contact the light emitting unit, so as toprevent the decrease in light intensity from occurring in the phosphorpowders of the wavelength converting layer due to heat generated by thelight emitting unit. Furthermore, at least one of the first and secondsurfaces of the wavelength converting layer is non-planar. When thefirst surface of the wavelength converting layer, which contacts themolding compound, is non-planar, the contact area between the wavelengthconverting layer and the molding compound increases, such that thephosphor powders excited by the light of the light emitting unit at thefirst surface increase, so as to enhance the quantity of light output.When the second surface of the wavelength converting layer, which doesnot contact the molding compound, is non-planar, the total reflectioncan be reduced while the light emitted by the light emitting unit passesthrough the second surface. Still further, the invention may dispose thelight transmissible member on the wavelength converting layer or betweenthe molding compound and the wavelength converting layer, wherein thelight transmissible member is used for guiding the light emitted by thelight emitting unit, so as to enhance the quantity of light output. Inaddition, the light transmissible member may solidify the light emittingcomponent. Moreover, the invention may dispose the reflective layer onthe side light emitting surface of the light emitting unit to reflectthe light emitted by the side light emitting surface of the lightemitting unit, so as to enhance the quantity of light output.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view illustrating a light emitting component ofthe prior art.

FIG. 2 is a schematic view illustrating a light emitting componentaccording to a first embodiment of the invention.

FIG. 3 is a schematic view illustrating a light emitting componentaccording to a second embodiment of the invention.

FIG. 4 is a schematic view illustrating a light emitting componentaccording to a third embodiment of the invention.

FIG. 5 is a schematic view illustrating a light emitting componentaccording to a fourth embodiment of the invention.

FIG. 6 is a schematic view illustrating a light emitting componentaccording to a fifth embodiment of the invention.

FIG. 7 is a schematic view illustrating a light emitting componentaccording to a sixth embodiment of the invention.

DETAILED DESCRIPTION

Referring to FIG. 2, FIG. 2 is a schematic view illustrating a lightemitting component 2 according to a first embodiment of the invention.As shown in FIG. 2, the light emitting component 2 comprises a lightemitting unit 20, a molding compound 22 and a wavelength convertinglayer 24. The light emitting unit 20 has a forward light emittingsurface 200. The molding compound 22 covers the light emitting unit 20.The wavelength converting layer 24 is disposed above the moldingcompound 22. The wavelength converting layer 24 has a first surface 240and a second surface 242 opposite to the first surface 240, wherein thefirst surface 240 is located between the forward light emitting surface200 and the second surface 242.

In this embodiment, the light emitting unit 20 may be, but not limitedto, a light emitting diode. A material of the molding compound 22 may besilicone, epoxy or other molding compounds. The wavelength convertinglayer 24 may be made of a mixture of a transparent glue and phosphorpowders. The wavelength converting layer 24 may convert a wavelength ofthe light emitted by the light emitting unit 20 into another wavelength,so as to change the light color of the light emitting unit 20.

As shown in FIG. 2, the first surface 240 of the wavelength convertinglayer 24 contacts the molding compound 22 and is non-planar.Furthermore, the second surface 242 of the wavelength converting layer24 is also non-planar. In this embodiment, the first surface 240 and thesecond surface 242 of the wavelength converting layer 24 may bewave-shaped. However, in another embodiment, the first surface 240 andthe second surface 242 of the wavelength converting layer 24 may besaw-toothed, scraggy or other regular/irregular shapes according topractical applications.

In this embodiment, the wavelength converting layer 24 may be madethrough, but not limited to, the disclosure of Taiwan Patent ApplicationNo. 102132241. Specifically, the wavelength converting layer 24 of theinvention is capable of deforming when a mechanical force is exerted onthe wavelength converting layer 24. In other words, the wavelengthconverting layer 24 is flexible. Accordingly, a non-planar surface maybe formed between the wavelength converting layer 24 and the moldingcompound 22 through a bonding process or other simple processes withouta complicated semiconductor process when the first surface 240 of thewavelength converting layer 24 contacts the molding compound 22.

Referring to FIG. 3 along with FIG. 2, FIG. 3 is a schematic viewillustrating a light emitting component 3 according to a secondembodiment of the invention. The main difference between the lightemitting component 3 and the aforesaid light emitting component 2 isthat the second surface 242 of the wavelength converting layer 24 of thelight emitting component 3 is planar. It should be noted that the sameelements in FIG. 3 and FIG. 2 are represented by the same numerals, sothe repeated explanation will not be depicted herein again.

Referring to FIG. 4 along with FIG. 2, FIG. 4 is a schematic viewillustrating a light emitting component 4 according to a thirdembodiment of the invention. The main difference between the lightemitting component 4 and the aforesaid light emitting component 2 isthat the first surface 240 of the wavelength converting layer 24 of thelight emitting unit 4 is planar. It should be noted that the sameelements in FIG. 4 and FIG. 2 are represented by the same numerals, sothe repeated explanation will not be depicted herein again.

As the light emitting components 2, 3 and 4 shown in FIGS. 2 to 4, theinvention may make at least one of the first surface 240 and the secondsurface 242 of the wavelength converting layer 24 to be non-planaraccording to practical applications. When the first surface 240 of thewavelength converting layer 24, which contacts the molding compound 22,is non-planar, the contact area between the wavelength converting layer24 and the molding compound 22 increases (e.g. the non-planar contactarea of the invention may be 1.1 times the planar contact are of theprior art), such that the phosphor powders excited by the light of thelight emitting unit 20 at the first surface 240 increase, so as toenhance the quantity of light output. When the second surface 242 of thewavelength converting layer 24, which does not contact the moldingcompound 22, is non-planar, the total reflection can be reduced whilethe light emitted by the light emitting unit 20 passes through thesecond surface 242. Moreover, the invention disposed the wavelengthconverting layer 24 above the molding compound 22, such that thewavelength converting layer 24 does not contact the light emitting unit20, so as to prevent the decrease in light intensity from occurring inthe phosphor powders of the wavelength converting layer 24 due to heatgenerated by the light emitting unit 20.

Referring to FIG. 5 along with FIG. 2, FIG. 5 is a schematic viewillustrating a light emitting component 5 according to a fourthembodiment of the invention. The main difference between the lightemitting component 5 and the aforesaid light emitting component 2 isthat the light emitting component 5 further comprises a lighttransmissible member 50. As shown in FIG. 5, the light transmissiblemember 50 is disposed on the wavelength converting layer 24, wherein thesecond surface 242 of the wavelength converting layer 24 contacts thelight transmissible member 50 and is planar. In this embodiment, thelight transmissible member 50 is used for guiding the light emitted bythe light emitting unit 20, so as to enhance the quantity of lightoutput. In addition, the light transmissible member 50 may solidify thelight emitting component 5. Furthermore, a material of the lighttransmissible member 50 may be glass, sapphire or other lighttransmissible materials. Specifically, since the wavelength convertinglayer 24 of the invention is capable of deforming when a mechanicalforce is exerted on the wavelength converting layer 24, the inventionmay dispose the wavelength converting layer 24 on the lighttransmissible member 50 first, dispose the light transmissible member 50on the molding compound 22, and then perform a bonding process or thelike to form the non-planar first surface 240. Accordingly, theinvention can save manufacture time and cost. It should be noted thatthe same elements in FIG. 5 and FIG. 2 are represented by the samenumerals, so the repeated explanation will not be depicted herein again.

Referring to FIG. 6 along with FIG. 2, FIG. 6 is a schematic viewillustrating a light emitting component 6 according to a fifthembodiment of the invention. The main difference between the lightemitting component 6 and the aforesaid light emitting component 2 isthat the light emitting component 6 further comprises a lighttransmissible member 60. As shown in FIG. 6, the light transmissiblemember 60 is disposed between the molding compound 22 and the wavelengthconverting layer 24, wherein the first surface 240 of the wavelengthconverting layer 24 contacts the light transmissible member 60 and isplanar, and the second surface 242 is non-planar. In this embodiment,the light transmissible member 60 is used for guiding the light emittedby the light emitting unit 20, so as to enhance the quantity of lightoutput. In addition, the light transmissible member 60 may solidify thelight emitting component 6. Furthermore, a material of the lighttransmissible member 60 may be glass, sapphire or other lighttransmissible materials. It should be noted that the same elements inFIG. 6 and FIG. 2 are represented by the same numerals, so the repeatedexplanation will not be depicted herein again.

Referring to FIG. 7 along with FIG. 2, FIG. 7 is a schematic viewillustrating a light emitting component 7 according to a sixthembodiment of the invention. The main difference between the lightemitting component 7 and the aforesaid light emitting component 2 isthat the light emitting component 7 further comprises a reflective layer70. As shown in FIG. 7, the reflective layer 70 is disposed on a sidelight emitting surface 202 of the light emitting unit 20 around theforward light emitting surface 200. In this embodiment, the reflectivelayer 70 can reflect the light emitted by the side light emittingsurface 202 of the light emitting unit 20, so as to enhance the quantityof light output. Preferably, a vertical height H1 of the reflectivelayer 70 may be larger than or equal to a vertical height H2 of the sidelight emitting surface 202 of the light emitting unite 20, so as toreflect the light emitted by the side light emitting surface 202 of thelight emitting unit 20 effectively. Furthermore, a side surface 700 ofthe reflective layer 70 and a side surface 244 of the wavelengthconverting layer 24 may be coplanar. Still further, a material of thereflective layer 70 may comprise polymer material (e.g. silicone, epoxy,etc.), metal oxide material (e.g. TiO₂, ZrO₂, Al₂O₃, ZnO, etc.), metalmaterial (e.g. Al, Ag, etc.) or a combination thereof. Preferably, thematerial of the reflective layer 70 may be the combination of thepolymer material and the metal oxide material, so as to reduce the costand simplify the process. It should be noted that the same elements inFIG. 7 and FIG. 2 are represented by the same numerals, so the repeatedexplanation will not be depicted herein again.

As mentioned in the above, the invention disposed the wavelengthconverting layer above the molding compound, such that the wavelengthconverting layer does not contact the light emitting unit, so as toprevent the decrease in light intensity from occurring in the phosphorpowders of the wavelength converting layer due to heat generated by thelight emitting unit. Furthermore, at least one of the first and secondsurfaces of the wavelength converting layer is non-planar. When thefirst surface of the wavelength converting layer, which contacts themolding compound, is non-planar, the contact area between the wavelengthconverting layer and the molding compound increases, such that thephosphor powders excited by the light of the light emitting unit at thefirst surface increase, so as to enhance the quantity of light output.When the second surface of the wavelength converting layer, which doesnot contact the molding compound, is non-planar, the total reflectioncan be reduced while the light emitted by the light emitting unit passesthrough the second surface. Still further, the invention may dispose thelight transmissible member on the wavelength converting layer or betweenthe molding compound and the wavelength converting layer, wherein thelight transmissible member is used for guiding the light emitted by thelight emitting unit, so as to enhance the quantity of light output. Inaddition, the light transmissible member may solidify the light emittingcomponent. Moreover, the invention may dispose the reflective layer onthe side light emitting surface of the light emitting unit to reflectthe light emitted by the side light emitting surface of the lightemitting unit, so as to enhance the quantity of light output.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A light emitting component, comprising: a lighttransmissive substrate comprising a wavelength converting layer and aresin layer formed on the wavelength converting layer; a light emittingunit attached to the light transmissive substrate, wherein the lightemitting unit has a forward light emitting surface facing to the lighttransmissive substrate and has electrodes arranged on one surfaceopposite to the forward light emitting surface; and a reflective layercovering the light emitting unit and a portion of the light transmissivesubstrate, and at least exposing the electrodes of the light emittingunit, wherein an interface between the wavelength converting layer andthe resin layer is non-planar, wherein the light emitting component hasa flat side surface comprising the reflective layer and the wavelengthconverting layer.
 2. The light emitting component of claim 1, whereinthe flat side surface further comprising the light transmissivesubstrate.
 3. The light emitting component of claim 1, wherein thereflective layer further exposes an area located between the electrodes.4. The light emitting component of claim 1, wherein a height of thereflective layer is larger than or equal to a height of the lightemitting unit.
 5. A light emitting component, comprising: a wavelengthconverting layer; a light emitting unit disposed on the wavelengthconverting layer, wherein the light emitting unit has a forward lightemitting surface facing to the wavelength converting layer; a reflectivelayer disposed on at least a portion of a side light emitting surface ofthe light emitting unit around the forward light emitting surface, andat least exposing electrodes of the light emitting unit; and a moldingcompound, at least covering the forward light emitting surface, disposedbetween the wavelength converting layer and the light emitting unit,wherein a surface of the molding compound is non-planar, wherein thelight emitting component has a flat side surface comprising thereflective layer and the wavelength converting layer.
 6. The lightemitting component of claim 5, wherein the reflective layer furtherexposes an area located between the electrodes.
 7. The light emittingcomponent of claim 5, wherein a height of the reflective layer is largerthan or equal to a height of the light emitting unit.
 8. A lightemitting component, comprising: a light transmissive substratecomprising a wavelength converting layer and a light guiding member; alight emitting unit disposed on the light transmissive substrate,wherein the light emitting unit has a forward light emitting surfacefacing to the wavelength converting layer, wherein the light emittingcomponent has a flat side surface comprising a reflective layer and thewavelength converting layer; and a molding compound disposed on thelight transmissive substrate and covering at least a portion of a sidelight emitting surface of the light emitting unit and at least exposingelectrodes of the light emitting unit, wherein a surface of thewavelength converting layer is non-planar.
 9. The light emittingcomponent of claim 8, wherein the flat side surface further comprisingthe molding compound.
 10. The light emitting component of claim 8,wherein the molding compound further exposes an area located between theelectrodes.
 11. The light emitting component of claim 8, wherein aheight of the molding compound is larger than or equal to a height ofthe light emitting unit.